As the global demand for high-performance computing and AI chips continues to rise,TSMC is accelerating the capacity layout of its advanced processes.According to supply chain sources,TSMC's 3nm wafer factory in Taiwan,China originally planned to achieve the goal of producing 150,000 wafers per month by the end of 2026,and now it is expected to further increase to 180,000 wafers,which is about 20%higher than originally expected.
 

At present,TSMC is making every effort to increase the wafer output of 3nm process.By the end of 2025,its monthly production capacity has stabilized between 120,000 and 130,000 wafers.According to the latest plan,by the end of 2026,this number will reach about 180,000 pieces,with an annual growth rate of over 40%.This means that in just one year,TSMC will increase the monthly production capacity of about 50,000 wafers to meet the demand from AI hardware,CPU and automotive electronics.Chip giants such as NVIDIA,AMD and Intel,as well as many automobile manufacturers,consume the 3nm process much faster than expected.In particular,the GPU and high-end CPU for AI training have become the key driving force for TSMC to continuously raise its wafer production target.
 

In addition to 3nm,TSMC's progress in 2nm process is equally remarkable.According to the plan,the 2nm process will start mass production at the end of 2025,and the initial yield performance is ideal.By the end of 2026,the monthly production capacity of 2nm wafers is expected to increase to nearly 100,000.In contrast,the monthly wafer input of 2nm at the end of 2025 is about 30,000 to 40,000 wafers,which means that the production capacity will increase by 1.4 times to 2.1 times within one year.

Keywords:wafer